User2User 2024 - 3D IC Chiplet Package Design Session Videos

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Silicon Photonics to Integrate Chiplets
User2User EU: This video provides background on their company, Swiss, which manufactures memory products in Berlin, Germany with complete in-house production capabilities.
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Customer-specific Solutions with Siemens EDA Tools
User2User EU: This video provides examples of capabilities within EDM tools like automation, configuration, and APIs to integrate with other systems.
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Pioneering Semiconductor Reliability Automotive Apps
User2User EU: This video provides background on IMEC, a research institute based in Belgium focused on semiconductor research and development.
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EMIB Based Advanced Packaging Flow NA
User2User: Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.
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EMIB Based Advanced Packaging Flow EU
User2User EU: EMIB technology and the provided design kits enable connecting multiple chips with different design rules, and the speaker outlines the overall design flow.
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Chiplets for future automotive application
User2User EU: The speaker concludes by highlighting the need for exploration of hardware/software architectures and co-optimization for automotive applications.
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Meeting future performance demands through packaging
User2User: Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.
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PDK Design Enablement – Beyond Xpedition Templates
User2User: Learn how Siemens addresses DRC, LVS, & assembly verification using EDA tools like Siemens XSI & Calibre 3DSTACK. We present a workflow for efficient verification across complex layers
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Advanced Physical Verification Flows for 3DIC's
User2User: Learn how 3DICs enhance system performance and compactness but challenge verification with their complex tech layers. We'll discuss methodologies, standards, and solutions, including Siemens XSI & Calibre 3DSTACK uses.
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Assembly Verification Flow For Silicon Interposers
User2User: Learn how 3DIC verification faces complex challenges. We address these using Siemens XSI and Calibre 3DSTACK, focusing on DRC, LVS, and assembly checks for high-end systems.
Accelerate product development | Siemens Software